The specific process flow of PMOLED display panels can be divided into five parts, namely backplane process (photolithography process), vapor deposition process, packaging process, screen body process, and module process:
(1) Lithography process: The driving backplate is fabricated through photolithography process, which mainly includes the preparation of ITO layer (indium tin oxide film, ITO conductive glass), molybdenum aluminum molybdenum layer, PI layer, and RIB layer on the substrate.
(2) Evaporation process: mainly includes substrate cleaning, organic material evaporation, and cathode aluminum layer evaporation.
(3) Packaging process: Starting from the feeding of the packaging sheet, it is sequentially cleaned, dried, attached, and glued. It is then pressed and cured with UV glue (Ultraviolet Rays) onto the evaporated material, followed by baking and testing to obtain a large screen body.
(4) Screen body technology: mainly includes the cutting and cleaning of large screen pieces, as well as electrical and visual inspection steps. After passing the inspection, they are stored in the warehouse.
(5) Module process: including processes such as ICBonding (chip bonding), FPC bonding (flexible circuit board bonding), adhesive coating, surface mounting, electrical testing, etc., followed by light shielding adhesion, appearance inspection, and finished product quality inspection. After passing the inspection, the products are packaged and stored.The specific process flow of PMOLED display panels can be divided into five parts, namely backplane process (photolithography process), vapor deposition process, packaging process, screen body process, and module process:
(1) Lithography process: The driving backplate is fabricated through photolithography process, which mainly includes the preparation of ITO layer (indium tin oxide film, ITO conductive glass), molybdenum aluminum molybdenum layer, PI layer, and RIB layer on the substrate.
(2) Evaporation process: mainly includes substrate cleaning, organic material evaporation, and cathode aluminum layer evaporation.
(3) Packaging process: Starting from the feeding of the packaging sheet, it is sequentially cleaned, dried, attached, and glued. It is then pressed and cured with UV glue (Ultraviolet Rays) onto the evaporated material, followed by baking and testing to obtain a large screen body.
(4) Screen body technology: mainly includes the cutting and cleaning of large screen pieces, as well as electrical and visual inspection steps. After passing the inspection, they are stored in the warehouse.
(5) Module process: including processes such as ICBonding (chip bonding), FPC bonding (flexible circuit board bonding), adhesive coating, surface mounting, electrical testing, etc., followed by light shielding adhesion, appearance inspection, and finished product quality inspection. After passing the inspection, the products are packaged and stored.